Arisawa Manufacturing Co. (Japan) and Nitto Denko

Chicago, Aug. 12, 2022 (GLOBE NEWSWIRE) — The bonding sheet market size is expected to grow from USD 386 million in 2022 to USD 551 million by 2027, growing at a CAGR of 7.4% between 2022 and 2027, according to a new report by MarketsandMarkets™. Emerging economies in Asia-Pacific and Europe are expected to experience increasing demand for bonding sheets owing to the development of the electronics industry and applications in flexible printed circuit boards (FPC) and multi-layer FPCs. Additionally, growing demand for consumer electronics, electric vehicles, and miniaturization of electronic components are the major driver for the growth of the bonding sheet market. Advancements in telecommunications such as 5G technology are also expected to increase the demand for bonding sheet during the forecast period. However, geopolitical uncertainties and high capital investments are hampering the growth of the market.

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Key players in the bonding sheet market are Arisawa Manufacturing Co. (Japan), DuPont (USA), NIKKAN INDUSTRIES Co., Ltd. (Japan), Dexerials Corporation (Japan), Nitto Denko Corporation (Japan), Showa Denko Materials Co. ., Ltd. (Japan), Toray Industries, Inc. (Japan), NAMICS Corporation (Japan) and Shin-Etsu Polymer Co., Ltd. (Japan). These players have adopted various growth strategies to expand their presence in the market. New product launch, investment and expansion have been the major strategies adopted by the major players over the past five years to enhance their competitiveness and expand their customer base in the global bonding sheet market.

Arisawa Manufacturing Co., Ltd. is one of the main players in the field of electronic/optoelectronic materials. The company manufactures covers, laminates, adhesive sheets and other electronic materials. It offers bonding sheet adhesives under the adhesive release sheet brand through the electronics-related materials business segment. Arisawa Manufacturing Co., Ltd. provides bonding sheets primarily for FPC applications as part of the product portfolio of FPC materials for electronics and telecommunications applications.

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Nitto Denko Corporation develops core technologies for adhesive-based products and manufactures bonding sheets, insulating materials, automotive electronics and other electronic products. It offers bonding sheets under the FB-ML4 brand through the Industrial Tape business segment. Nitto Denko Corporation manufactures acrylic and polyester bonding sheets ideal for electronics/optoelectronics, household appliances, LED substrates and other applications. The company has manufacturing facilities in Japan and other Asia-Pacific countries such as China, Thailand, Korea and others.

Another significant player in the bonding sheet market is DuPont (USA), a major bonding sheet manufacturing company engaged in the R&D, manufacturing, processing, marketing and supply of bonding sheets. Its product portfolio includes the Pyralux brand of bonding sheets in various qualities and adhesive thicknesses for electronics, telecommunications, automotive and other applications. The company has a global sales presence with manufacturing sites and sales offices in Asia Pacific, Europe, North America, South America, the Middle East and Africa.

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