Radiation-hardened electronics market worth $1.8 billion by 2027
CHICAGO, May 24, 2022 /PRNewswire/ — The report “Radiation Hardened Electronics Market by Component (Mixed-Signal ICs, Processors & Controllers, Memory, Power Management), Manufacturing Techniques (RHBD, RHBP), Product Type, Application, and Geography – Global Forecast up to ‘in 2027’published by MarketsandMarkets™, is expected to increase from $1.5 billion in 2022 at $1.8 billion by 2027; it is expected to grow at a CAGR of 4.0% from 2022 to 2027. Increasing technological advancement in multi-core processors for military and space applications is driving the radiation hardened electronics market. Furthermore, the growing demand for electronic systems capable of withstanding a harsh nuclear environment; and increasing intelligence, surveillance and reconnaissance (ISR) activities across the globe is playing a key role in the growth of the radiation hardened electronics market
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“Power electronics component will hold the largest radiation-hardened electronics market size during the forecast period”
The power electronics in components segment is expected to account for the largest radiation-hardened electronics market size throughout the forecast period. The growth is mainly due to the increasing use of MOSFET power electronics in space and high-reliability applications due to its high durability against high-energy charged particles and ionizing radiation. Manufacturers are constantly focusing on accelerating the performance of MOSFET devices for space applications. For example, IR HiRel (USA), a private subsidiary of Infineon Technologies AG (USA) offers the Si MOSFET device which helps improve system efficiency and lower cost per bit in broadband satellites. The R9 MOSFET also supports satellite designers with a wide range of gate drivers and improved current capabilities.
“COTS in product type segment is expected to grow at the fastest CAGR during the forecast period”
The radiation hardened electronics market for COTS segment holds the majority of the share and is expected to grow at the fastest CAGR during the forecast period. The increasing development of low-cost nanosatellites has accelerated the growth opportunities for the COTS product type. COTS also offers attractive signal processing designs that further increase their adoption among military space missions. COTS offers an attractive option to reduce the cost of space applications as they can be replaced with pin-compatible ceramic packages, which provide the same functionality as the original device. This results in significant cost savings and reduces risk and development time.
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“North America is expected to dominate the radiation hardened market during the forecast period“
the North America The region accounted for the largest share of the radiation hardened electronics market during the forecast period. This dominance and growth is driven by the growing demand for radiation-hardened components in commercial and military satellite applications. The Department of Defense (DoD) and other commercial industries in the United States require reliable, radiation-resistant microelectronics to support programs such as nuclear modernization efforts and satellites. The US government continually strives to maintain and expand the nation’s manufacturing capabilities for radiation-hardened microelectronics. For example, in December 2021the United States government has issued an authorization for the use of Title III of the Defense Production Act (DPA) to expand and strengthen the nation’s industrial base of radiation-hardened microelectronics.
The major players in the radiation hardened electronics market are Microchip Technology Inc. (US), BAE Systems (UK), Renesas Electronics Corporation (Japan), Infineon Technologies SA (Germany), STMicroelectronics (Swiss), Xilinx, Inc. (USA), Texas Instruments Incorporated (USA), Honeywell International Inc. (USA), Teledyne Technologies Inc. (USA) and TTM Technologies, Inc. (USA ). The SMEs/startups covered by the study are Cobham Limited (UK), Analog Devices, Inc (US), Data Devices Corporation (US), 3D Plus (France), Mercury Systems, Inc. (USA), PCB Piezotronics, Inc (USA), Vorago (USA), Micropac Industries, Inc (USA), GSI Technology, Inc (USA), Everspin Technologies Inc (US), Semiconductor Components Industries, LLC (US), AiTech (US), Microelectronics Research Development Corporation (US), Space Micro, Inc (US) and Triad Semiconductor ( United States).
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