Redistribution Layer Materials Market Size ($ 301.6 Million by 2028) Led by Consumer Electronics Devices (9.5% CAGR) Impact of Coronavirus Outbreak and Global Analysis and Forecast from TheInsightPartners. com


The Redistribution Coating Materials market size will reach $ 301.6 million by 2028, from $ 159.8 million in 2021 to grow at a CAGR of 9.5% from 2021 to 2028; while the market growth is driven by the consumer electronics and semiconductor industry.

New York, November 04, 2021 (GLOBE NEWSWIRE) – Redistribution Layer Materials Market: Key Insights
According to our latest market research on Redistribution Layer Materials Market Size, Share, Revenue, Forecast to 2028 – COVID-19 Impact and Global Analysis by Material Type [Polyimide (PI), Polybenzoxazole (PBO), Benzocylobutene (BCB), and Others] and application [Fan-Out Wafer Level Packaging (FOWLP) and 2 5D/3D IC Packaging].

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Market size Value in

US $ 159.8 million in 2021

Market size Value per

$ 301.6 million by 2028

Rate of growth

9.5% CAGR from 2021 to 2028

Forecast period


Year of reference


Number of pages


Number of tables


Number of graphs and figures


Historical data available


Covered segments

Material type and application

Regional scope

North America; Europe; Asia Pacific; Latin America; MEA

Country scope

United States, United Kingdom, Canada, Germany, France, Italy, Australia, Russia, China, Japan, South Korea, Saudi Arabia, Brazil, Argentina

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Revenue forecast, company ranking, competitive landscape, growth factors and trends

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Redistribution Layer Materials Market: Competition Landscape and Key Developments
Shin-Etsu Chemical Co., Ltd .; Jiangsu Changjiang Electronics Technology Co., Ltd .; Fujifilm Holding Company; Hitachi Chemical DuPont MicroSystems, LLC; ASE Group; Amkor technology; Infineon Technologies SA; NXP semiconductors; Samsung Electronics Co., Ltd. ; and SK Hynix Inc. are among the established players operating in the redistributive layer materials market.

Asia-Pacific is expected to be the fastest growing region for the redistributive coating materials market during the forecast period. The market growth in this region is mainly attributed to the presence of large semiconductor manufacturing centers in the region. Taiwan, China, Japan, and South Korea are prominent Asian countries that include large semiconductor manufacturing units. In addition, cheap labor, skilled professionals and lower cost of raw materials in this region are boosting the semiconductor industry. The proliferation of smartphones is driving the demand for smaller circuits, which in turn creates the need for small, high-performance circuits. APAC is among the leading regions for the industrial and manufacturing sector, which positively influences the growth of semiconductor packaging technology. In addition, the presence of companies such as ASE Group, Fujifilm, Samsung, SK Hynix and Shin-Etsu Chemical in the Asian territory is another dominant factor impacting the growth of the market.

Growing trend of miniaturization of consumer electronics Is expected to drive the growth of the Redistribution Layer Materials market over the forecast period:
The consumer electronics industry is evolving at an exponential rate. The pressure of demands on the consumer side has forced suppliers to offer distinguished products and to be the first players in the market. Cutthroat competition with peers in the consumer electronics industry has resulted in price wars leading to lower profitability for manufacturers. Due to these factors, manufacturers are constantly striving to innovate in their product offerings. Often, manufacturers have been curious to become the pioneers of new products in the market. Analog-to-digital conversion has resulted in many new audio and video standards, which have improved the quality and accessibility of the digital media experience.

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In addition, with the rise of broadband, media access has become easy and rewarding for consumers. The proliferation of intelligent products prompts engineers to improve the design of electronic products and focus on reducing costs, reducing power and superior performance through the integration of discrete functions.

Today’s smart products contain complex electronic systems that require flawless operation in the real world. Device miniaturization, support for multiple wireless technologies, faster data rates, and longer battery life require careful analysis. Additionally, the demand for many feature integrations on a single device has led to complex printed circuit designs for these electronic components. For example, a smartphone includes a camera, a call function, a torch, storage drives, connectivity with other devices, compatible ports for connections, a media player, and many other functions. Likewise, other consumer electronics devices have improved on similar lines, encouraging semiconductor manufacturers to further miniaturize chips and incorporate more functionality.

Redistribution Layer Materials Market: Segment Overview
Based on the material type, the redistributing coating materials market is segmented into Polyimide (PI), Polybenzoxazole (PBO), Benzocylobutene (BCB), and others. The polyimides (PI) segment accounted for the largest market share in 2020. Polyimides are thermoplastics made from high viscosity polymeric materials in the molten state and require higher pressure to shape the molded parts. A polymeric material is required for the redistribution layer in advanced packaging techniques, which catalyzes the bond between solder balls and I / O pads. The redistributive materials are used as passivation layers for shock and stress buffers. Polyimides have excellent chemical resistance, mechanical strength, thermal stability and electrical properties. Thus, all of these factors are expected to propel the demand for polyimides during the forecast period.

Based on application type, the redistribution layer materials market is segmented into distribution wafer level packaging (FOWLP) and 2.5D / 3D IC packaging. The 2.5D / 3D integrated circuit packaging segment accounted for a larger market share in 2018. The increasing costs of lithography steps and general wafer processing on next-generation silicon nodes are pushing the industry to find solutions. alternatives to improve the efficiency and functionality of electronic devices. . In addition, the industry is turning to 3D integration as a solution to combine various technologies such as logic, memory, RF, sensors, etc. in small form factors. Beyond 2.5D, 3D integrated circuits, also known as vertical stacking, offer faster access to memory and lower latency between memory and processor. Market drivers for 3D integration begin with high-end computing, servers and data centers, medical devices, as well as military and aerospace.

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Impact of the COVID-19 pandemic on the redistribution layer materials market:
The global electronics and semiconductor industry is one of the major industries that has suffered severe disruption due to supply chain disruptions, cancellations of technology events, and plant closures. and offices caused by the COVID-19 epidemic. China is the global manufacturing hub and the largest supplier of raw materials for various industries, and it is also one of the worst affected countries. The lockdown of various factories and factories in China has affected global supply chains and negatively impacted the manufacturing, delivery schedules and sales of various electronic products. This has affected the manufacturing and sales of semiconductors such as chips. In addition to this, global travel bans imposed by countries in Europe, Asia and North America have also impacted business collaborations and partnership opportunities. All of these factors have had a negative impact on the electronics and semiconductor industry and the RDL market in the near term. However, with businesses reopening after the lockdown following COVID-19 security protocols and the start of vaccination campaigns, semiconductor manufacturing has begun.

Key Questions to Ask for Redistributing Layer Materials Market:

  • Can you list some of the major players operating in the global Redistribution Layer Materials market?

  • Which region held the largest share of the global redistribution layer materials market?

  • Based on type, why the polyimide (PI) segment accounted for the largest share of the global redistribution layer materials market?

  • Based on hardware, which segment is expected to grow at the fastest rate during the forecast period?

  • Based on type, who held the fastest CAGR in the redistribution layer materials market during the forecast period?

  • Which region has the fastest CAGR in the Global Redistribution Layer Materials market?

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