Valued at $ 50.6 billion by 2026, advanced semiconductor packaging expected to experience robust growth globally

SAN FRANCISCO, December 8, 2021 / PRNewswire / – A new market study released by Global Industry Analysts Inc., (GIA), the leading market research firm, today released its report titled “Advanced Semiconductor Packaging – Global Market Trajectory and Analysis”. The report presents new perspectives on the opportunities and challenges in a dramatically transformed post-COVID-19 market.

Advanced semiconductor packaging

Editing: 9; Posted: November 2021
Executive pool: 432
Companies: 87 – Players covered include Amkor Technology, Inc .; ASE Technology Holding, Co., Ltd. ; China Wafer Level CSP Co., Ltd .; ChipMOS Technologies, Inc .; FlipChip International LLC; HANA Micron Inc .; Jiangsu Changjiang Electronics Technology Co., Ltd. ; King Yuan Electronics Corp. (KYEC); Nepes Society; Powertech Technology, Inc .; Samsung Semiconductor, Inc .; SIGNAGE; Tianshui Huatian Technology Co., Ltd. ; TongFu Microelectronics Co., Ltd. ; TSMC Ltd. ; UTAC Holdings Ltd .; Veeco Instruments Inc. and others.
Blanket: All major geographies and key segments
Segments: Technology (Flip Chip packaging, 2.5D / 3D packaging, FI WLP, FO WLP); (Consumer electronics, industry, automotive, aerospace and defense, other end uses)
Geographies: World; United States; Canada; Japan; China; Europe (France; Germany; Italy; UK; and rest of Europe); Asia Pacific; Rest of the world.

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Global Advanced Semiconductor Packaging Market to Reach US $ 50.6 billion by 2026
The growth of the advanced semiconductor packaging market is driven by the increasing trend towards miniaturization. Constant transitions and miniaturization of nodes were regular features that the industry faced, and now ULSI manufacturing resulting in increased wafer size is still driving market growth. As many companies focus more on R&D, the number of manufacturers offering innovative products is increasing. Factors such as the growing number of consumers using electronic devices, consumer preference for lighter, thinner and smaller products leading to the need for electronic products with advanced architecture, and the growing demand for connected devices such as tablets and smartphones are also driving the growth of the advanced semiconductor packaging market. Growing interest in device miniaturization in various industries is driving market gains. In addition, the increasing use of 2.5D packaging in chips and 3D integrated circuits in smartphones and other mobile devices is expected to drive the demand for advanced packaging.

Amid COVID-19 Crisis, Global Advanced Packaging Semiconductor Market is estimated to be US $ 32.6 billion in 2020, is expected to reach a revised size of US $ 50.6 billion by 2026, with a CAGR of 7.7% over the analysis period. Flip Chip Packaging, one of the segments analyzed in the report, is expected to grow at a CAGR of 7.3% to reach US $ 40.2 billion at the end of the analysis period. After a thorough analysis of the business implications of the pandemic and the induced economic crisis, the growth of the 2.5d / 3d packaging segment is readjusted to a revised CAGR of 10.2% for the next 7-year period. This segment currently accounts for a 9.6% share of the global advanced semiconductor packaging market. A step up from traditional 2D IC packaging technology, 2.5D packaging allows for thinner lines and spaces. 2.5D packages are commonly used in ASICs, FPGAs, GPUs, and high-end memory cubes. The demand for high speed flip chip packages is creating an opportunity for highly integrated multichip modules (MCMs) and 2.5D / 3D silicon (Si) interposer packages.

The US market is estimated at $ 3.2 billion in 2021, when China is expected to reach $ 14.3 billion by 2026
The advanced semiconductor packaging market in the United States is estimated at US $ 3.2 billion in 2021. The country currently represents a 9.48% share of the global market. China, the world’s second-largest economy, is expected to reach an estimated market size of US $ 14.3 billion during the year 2026, with a CAGR of 9.8% throughout the analysis period. Other notable geographic markets include Japan and Canada, each projects growth of 5.3% and 6% respectively during the analysis period. In Europe, Germany is expected to grow by around 5.4% CAGR while the rest of the European market (as defined in the study) will reach US $ 1.5 billion at the end of the analysis period. North America is an important market for advanced packaging technologies, where growth is supported by the existence of several semiconductor companies and growing government initiatives to encourage the semiconductor and electronics manufacturing industry . Growing demand for wireless sensors / mobiles, fingerprint sensors and CIS is expected to fuel the growth of WLCSP and copper pillar in the Asia Pacific Region. In addition, the increasing penetration of IoT in several areas, supporting government policies in various countries, and increasing attention to smart infrastructure and smart city are fueling the market growth in the region.

FI WLP segment to be reached $ 3.2 billion by 2026
In the global FI WLP segment, United States, Canada, Japan, China and Europe will lead to the estimated 5.8% CAGR for this segment. These regional markets representing a combined market size of US $ 1.6 billion in 2020 will reach a projected size of US $ 2.5 billion at the end of the analysis period. China will remain among the most dynamic of this group of regional markets. Led by countries such as Australia, India, and South Korea, the market of Asia Pacific should reach US $ 2 billion by 2026. Following

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